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6/8/12 wafer debinding machine for uv led debinding

Click:[691] Publish Time:2022-12-13

  6/8/12 wafer debinding machine for uv led debinding

  Role: uvled decoupler for optical semiconductor materials UV film decoupling use.

  Features: made of UV LED light source, tight structure low temperature, uniform exposure, small energy consumption, long service life, reach curing time UV lamp automatically shut down, to prevent personnel from taking material UV leakage, resulting in human injury.  

  Light source: UV LED lamp  

  uvled uncoupler luminous area: 200 * 200mm  

  Light intensity intensity: 100-10000mw  

  UV wavelength: 365/385/395/405+5nm  

  Light intensity uniformity: 90% +  

  Applicable product size: 200m*200mm UVLED uncoupler  

  Irradiation method: bottom up irradiation, curing product tray bottom 

  Cooling method: air-cooled or water-cooled  

  Lifespan: 20,000 hours of LED lamp beads 

  Irradiation height: 50-200m, any height adjustment, according to the actual use of customers  

  uvled unglueing machine control mode: 

  1、Automatic moving mode: the product is placed on the partition inside the box. Close the door automatically open the UV lamp (door frame is equipped with sensors automatically induction), to reach the curing time UV lamp automatically shut down waiting for manual pick up material.

  2、Manual mode: after placing the product manually press the switch on the operation panel to open the UV lamp, reach the curing time UV lamp automatically off waiting for the personnel to take the material.